This kind of casing is usually put into the mold by the user, and the main processes such as blanking (shape), opening, stretch forming and the like are completed on the large-tonnage punch to complete the casing processing. The advantages of this processing method are that it can greatly reduce the labor cost, reduce the error rate of products caused by human intervention, and the casing has good consistency and high qualified rate. However, the disadvantage is that the mold is invested at one time. In view of the above characteristics, two conditions must be met to adopt this processing method, one is the product type, the other is the large demand, the mold fee is very low to a single casing.

This type of casing is usually put into the mold by the user, and the main processes such as blanking (shape), hole opening, and stretch forming are completed on a large-tonnage punch machine to complete the casing processing.

Semiconductor equipment is the use of semiconductor components to manufacture electrical equipment, semiconductor, refers to the room temperature conductivity between the conductor and insulator materials.